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Probe Card PCB

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Probe Card PCB

Model Number : Probe Card PCB

Surface Finish : Selective Hard Gold, ENIG, HASL, OSP

Packaging Details : Vakuumverpackung + Antistatikbeutel, Trockenmittel, Temperaturanzeigekarte, Karton

MOQ : 1PCS

Delivery Time : 5-15 Werktage, Eilbestellung möglich

Impedance Control : ±5%~±8% Tolerance

Brand Name : JQPCB

Special Process : Back Drill, POFV Via-in-Pad, HDI Laser Microvia, Plasma Desmear

Payment Terms : L/C,D/A,D/P,T/T

Product Name : Probe Card PCB

BGA Pitch : 0.25mm~0.35mm

Price : negotiate

Layer Count : 20~60 Layers (High-end, max up to 130 layers)

Supply Ability : 20000 Quadratmeter / Monat

Material : FR4+Rogers

Flatness : Warpage ≤0.3%

Certification : GB/T 19001-2016/IS0 9001:2015

Min Trace/Space : 2.5~4mil (0.06~0.1mm)

Place of Origin : China

Application : Semiconductor Wafer Test, ATE Test System

Feature : High Density BGA, Low CTE, High Frequency Performance

Service : Custom Fabrication based on Gerber Files

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Probe Card PCB, also known as wafer test board, is a high-precision multilayer printed circuit board used for semiconductor wafer probing. It acts as the signal bridge between ATE automatic test equipment and bare silicon wafers to test IC electrical performance before chip packaging.

Key Features

  • High density BGA pad layout, ultra-fine trace & space technology
  • Controlled impedance, available with high-frequency materials like Rogers, Isola
  • Strict dimensional tolerance to ensure precise probe alignment
  • Custom multi-layer stack-up, round & special shape PCB supported
  • Rigorous electrical test and inspection before delivery

Applications

Semiconductor wafer testing, IC chip inspection, ATE test system, probe card assembly.

Probe Card PCB Technical Info

  • Layer count: High-end version 20~60 layers, max up to 130 layers for ultra complex ATE test
  • Material: Rogers RO4350B/RO4003C, BT resin, HTG FR4, FR4+Rogers hybrid stack-up
  • Min trace/space: 2.5~4mil (0.06~0.1mm)
  • Core & Special Process:
  1. Controlled impedance (±5% tolerance)
  2. Selective hard gold plating (Au>40u" for probe contact area)
  3. POFV Via-in-Pad filled copper
  4. Back drilling for high speed signal
  5. High aspect ratio drilling
  6. Strict warpage control ≤0.3%
  7. HDI laser microvia available
  • Application: High pin count semiconductor wafer probing & IC ATE test

About JQPCB

JQPCB specializes in manufacturing high-end PCBs including probe card PCB, IC substrate, rigid-flex PCB, multilayer BGA PCB and PCBA assembly. We support custom fabrication according to your Gerber files and specifications. Send us your drawings to get a competitive FOB quotation.


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